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您当前的位置:首页 » 新闻中心 » 星坤厂家为您讲述电子组装行业技术SMT和DIP
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星坤厂家为您讲述电子组装行业技术SMT和DIP
发布时间:2018-12-19        浏览次数:19        返回列表
 

 

SMT(Surface Mount Technology的缩写),是表面贴装技术,是目前电子组装行业里最流行的一种技术和工艺。它是一种将无引脚或短引线表面组装元器件安装在印制电路板(PCB)的表面或其它基板的表面上,通过回流焊或浸焊等方法加以焊接组装的电路装连技术。

DIP是Dual In-line Package的缩写,也叫双列直插式封装技术,双入线封装,DRAM的一种元件封装形式。指采用双列直插形式封装的集成电路芯片,绝大多数中小规模集成电路均采用这种封装形式,其引脚数一般不超过100。

SMT的特点:

1、组装密度高、电子产品体积小、重量轻,贴片元件的体积和重量只有传统插装元件的1/10左右,一般采用SMT之后,电子产品体积缩小40%~60%,重量减轻60%~80%。

2、可靠性高、抗震能力强。焊点缺陷率低。

3、高频特性好。减少了电磁和射频干扰。

4、易于实现自动化,提高生产效率。降低成本达30%~50%。节省材料、能源、设备、人力、时间等。

DIP封装的特点:

适合在PCB(印刷电路板)上穿孔焊接,操作方便。

芯片面积与封装面积之间的比值较大,故体积也较大。

DIP封装的CPU芯片有两排引脚,需要插入到具有DIP结构的芯片插座上。当然,也可以直接插在有相同焊孔数和几何排列的电路板上进行焊接。

DIP封装的芯片在从芯片插座上插拔时应特别小心,以免损坏管脚。

        广东星坤科技股份有限公司是集研发、生产、销售于一体的打造全球电子零组件电子产品服务商,目前星坤在全球已有多家超大规模高科技自动化生产工厂,在全球设立多个独立运营的销售中心,星坤产品广泛应用于全球各大领域。

了解更多行业资讯欢迎访问星坤官网www.helloxkb.cn。

Surface-mount technology (SMT) is a method for producing electronic circuits in which the components are mounted or placed directly onto the surface of printed circuit boards (PCBs). An electronic device so made is called a surface-mount device (SMD).

Dual in-line pin package (DIP) is an electronic component package with a rectangular housing and two parallel rows of electrical connecting pins. The package may be through-hole mounted to a printed circuit board (PCB) or inserted in a socket.

SMT features:

The assembly density is high, the electronic product volume is small, the weight is light, the volume and the weight of the patch element is only about 1/10 of the traditional interpolation element, generally after using SMT, the electronic product volume reduces by 40%~60%, the weight reduces by 60%~80%.

High reliability, strong earthquake resistance. Low solder joint defect rate.

High frequency characteristic is good, reduced electromagnetism and radio frequency interference.

Easy to realize automation and improve production efficiency. Cost reduction up to 30%~50%. Save material, energy, equipment, manpower, time and so on.

DIP features:

Suitable for punching and welding on PCB(printed circuit board), easy to operate.

The ratio between chip area and package area is larger, so the volume is larger.

The DIP encapsulated CPU chip has two rows of pins that need to be plugged into a chip socket with a DIP structure. Of course, it can also be directly inserted into the board with the same number of holes and geometric arrangement for welding.

DIP encapsulated chips should be inserted and unplugged from the chip socket with special care to avoid damaging the pin.

XKB is a global well-known brand of electronic component, founded by XKB group. XKB group is an electronic product service provider integrating r&d, production and sales.Since 1995,XKB founded in Taiwan,at present, there are many super - scale high - tech automation production factories in the world.At the same time, XKB goes global and sets up several independent sales centers in the world. XKB products are widely used in various global fields.